BLC2425M8LS300P

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© Ampleon Netherlands B.V. 2016. All rights reserved.

Poduct data sheet

Rev. 3 — 17 June 2016

4 of 12

BLC2425M8LS300P

Power LDMOS transistor

7.3 Test circuit

Fig 1.

Definition of transistor impedance

001aak544

gate 1

gate 2

drain 2

drain 1

Printed-Circuit Board (PCB): Rogers RT/Duroid 6035HTC; thickness = 0.762 mm;

thickness copper plating = 35

m.

See Table 9 for a list of components.

Fig 2.

Component layout for production test circuit

Table 9.

List of components

See Figure 2 for component layout.

Component

Description

Value

Remarks

C1, C2, C3, C12, C13

multilayer ceramic chip capacitor

36 pF

ATC 800B

C4, C6, C15, C17

multilayer ceramic chip capacitor

10

F, 50 V

C5, C7, C14, C16

multilayer ceramic chip capacitor

470 nF, 50 V

C8, C9

multilayer ceramic chip capacitor

1.4 pF

ATC 100B

C10, C11

multilayer ceramic chip capacitor

1.8 pF

ATC 100B

C18, C19

multilayer ceramic chip capacitor

24 pF

ATC 800R

aaa-016352

R2

R1

C3

C7

C6

C1

60 mm

40 mm

40 mm

C4 C5

C2

R3

C12

C18

C19

C16

C17

C13

C14

C15

C11

C10

C8

C9

C21

C20