BAS21 datasheet(2/4 Pages) VISHAY

2 / 4 page

BAS19, BAS20, BAS21

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Vishay Semiconductors

Rev. 1.2, 13-Feb-18

Document Number: 85540

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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Note

(1) Device on fiberglass substrate, see layout drawing below



LAYOUT FOR RthJA TEST

Thickness:



Fiberglass 1.5 mm (0.059 inches)



Copper leads 0.3 mm (0.012 inches)

THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

Thermal resistance junction to ambient air

RthJA (1)

430

°C

Junction temperature

150

°C

Storage temperature range

Tstg

-65 to +150

°C

Operating temperature range

Top

-55 to +150

°C

ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

PART

SYMBOL

MIN.

TYP.

MAX.

UNIT

Forward voltage

IF = 100 mA

1.0

IF = 200 mA

1.25

Leakage current

VR = 100 V

BAS19

100

VR = 150 V

BAS20

100

VR = 200 V

BAS21

100

VR = VRmax., Tj = 150 °C

100

μA

Dynamic forward resistance

IF = 10 mA



Diode capacitance

VR = 0, f = 1 MHz

5pF

Reverse recovery time

IF = IR = 30 mA, RL = 100 ,

iR = 3 mA

trr

17451

15 (0.59)

12 (0.47)

0.8 (0.03)

5 (0.2)

7.5 (0.3)

3 (0.12)

1 (0.4)

2 (0.8)

1.5 (0.06)

5.1 (0.2)

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