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LM239DR2G 数据表(PDF) 11 Page - ON Semiconductor |
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LM239DR2G 数据表(HTML) 11 Page - ON Semiconductor |
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11 / 14 page ![]() SOIC−14 NB CASE 751A−03 ISSUE L DATE 03 FEB 2016 SCALE 1:1 1 14 GENERIC MARKING DIAGRAM* XXXXXXXXXG AWLYWW 1 14 XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. STYLES ON PAGE 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. H 14 8 7 1 M 0.25 B M C h X 45 SEATING PLANE A1 A M _ S A M 0.25 B S C b 13X B A E D e DETAIL A L A3 DETAIL A DIM MIN MAX MIN MAX INCHES MILLIMETERS D 8.55 8.75 0.337 0.344 E 3.80 4.00 0.150 0.157 A 1.35 1.75 0.054 0.068 b 0.35 0.49 0.014 0.019 L 0.40 1.25 0.016 0.049 e 1.27 BSC 0.050 BSC A3 0.19 0.25 0.008 0.010 A1 0.10 0.25 0.004 0.010 M 0 7 0 7 H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 __ _ _ 6.50 14X 0.58 14X 1.18 1.27 DIMENSIONS: MILLIMETERS 1 PITCH SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 0.10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98ASB42565B DOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 SOIC−14 NB © Semiconductor Components Industries, LLC, 2019 www.onsemi.com |
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