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USB5744 数据表(PDF) 33 Page - Microchip Technology |
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USB5744 数据表(HTML) 33 Page - Microchip Technology |
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33 / 51 page ![]() 2022 Microchip Technology Inc. and its subsidiaries DS00001855L-page 33 USB5744 10.3 Package Thermal Specifications FIGURE 10-1: SUPPLY RISE TIME MODEL Note: The rise time for the 1.2V and 3.3V supplies can be extended to 100 ms max if RESET_N is actively driven low, typically by another IC, until 1 us after all supplies are within operating range. TABLE 10-1: PACKAGE THERMAL PARAMETERS Symbol °C/W Velocity (Meters/s) JA 30 0 26 1 JT 0.2 0 0.3 1 JC 2.6 0 2.6 1 Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51. TABLE 10-2: MAXIMUM POWER DISSIPATION Parameter Value Units PD(max) 1400 mW t10% 10% 90% Voltage TRT t90% Time 100% 3.3 V VSS VDD33 90% 100% 1.2 V VDD12 |
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