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PLZ 数据表(PDF) 1 Page - Vishay Siliconix |
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PLZ 数据表(HTML) 1 Page - Vishay Siliconix |
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1 / 9 page  PLZ Series www.vishay.com Vishay Semiconductors Rev. 1.7, 27-May-2020 1 Document Number: 84830 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Zener Diodes Permitting 500 mW Power Dissipation LINKS TO ADDITIONAL RESOURCES FEATURES • Sillicon planar Zener diodes, ultra small • Low profile MicroSMF (DO-219AC) package • Low leakage current • Excellent stability • High temperature soldering: 260 °C / 10 s at terminals • Wave and reflow solderable (reflow as per JPC / JEDEC® J-STD 020) (double wave as per IEC 61760-1) • AEC-Q101 qualified available • Base P/N-G3 - RoHS-compliant, green, industrial grade • Base P/N-HG3 - RoHS-compliant, green, AEC-Q101 qualified • ESD immunity acc. IEC 61000-4-2 acc. to part table • Surge performance acc. to part table • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT VZ range nom. 2.0 to 39 V Test current IZT 5 to 20 mA VZ specification Pulse current Circuit configuration Single eSMP® Series 20278 1 2 333 DDD3 D 3D Models Models Related Documents Available ORDERING INFORMATION DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY PLZ-Series Part number-G3/H 4500 per 7" reel (8 mm tape) 22 500 / box PLZ-Series Part number-HG3_A/H PACKAGE PACKAGE NAME WEIGHT MOLDING COMPOUND FLAMMABILITY RATING MOISTURE SENSITIVITY LEVEL SOLDERING CONDITIONS MicroSMF (DO-219AC) 4.8 mg UL 94 V-0 MSL level 1 (according J-STD-020) 260 °C / 10 s at terminals ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Power dissipation Mounted on FR4 board 50 mm x 50 mm x 1.6 mm, solder land 10 mm x 10 mm, Tamb = 85 °C Ptot 500 mW Power dissipation Mounted on FR4 board 50 mm x 50 mm x 1.6 mm, solder land 10 mm x 10 mm, Tamb = 25 °C Ptot 960 Power dissipation Mounted on FR4 board with recommended soldering footpads (reflow) Ptot 340 Non-repetitive peak surge power dissipation tp = 8/20 μs acc. IEC 61000-4-5 (PLZ5V1A to PLZ39D) PZSM 100 W tp = 8/20 μs acc. IEC 61000-4-5 (PLZ2V7A to PLZ4V7C) PZSM 70 W Z-current IZ Ptot/VZ mA Junction temperature Tj 150 °C Storage temperature range Tstg -55 to +150 THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Typ. thermal resistance junction to ambient air Mounted on FR4 board 50 mm x 50 mm x 1.6 mm, solder land 10 mm x 10 mm RthJA 130 K/W Typ. thermal resistance junction to lead RthJL 40 K/W ELECTRICAL SPECIFICATIONS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Forward Voltage IF = 10 mA VF 0.8 0.9 V |
类似零件编号 - PLZ |
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