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Analog Technologies

Evaluation Board for ATLS201D

ATLS201DEV1.0

Figure 3. Top Silkscreen

Figure 4. Top Layers without Top Screen Layer

Figure 4 shows the top layers without the silkscreen layer.

Figure 5 below shows the bottom layers, including bottom

copper, bottom solder mask, and multilayer (vias). Please

notice that it is a “see through” image from the top side.

Figures 4 and 5 can be used as a layout reference for

designing a system when using the ATLS201D in the system.

The main points are shown below:

1. Connect the power supply return node directly to the

PGND pin of the driver before connecting it to any other

nodes. For thermal management purpose, the return node on

the evaluation board was not done in this way.

2. Use as large copper area as possible for the PCB traces of

the solder pads of all the pins so that these copper areas

become heat-sinks which can help dissipating the heat

generated by the driver.

Figure 5. Bottom Layers

Figure 6. Mirrored Bottom Layers

Figure 6 shows the mirrored bottom layers which is a

directly-seen image from the bottom side.

The ATLS201D laser driver module is located in the center

of the ATLS201DEV1.0 Evaluation Board. The voltages of

all its pins can be measured directly by probing the vias on

the left and right side of the module sockets which are

connected directly with the pins of the electronic module.