TS6601H datasheet(7/7 Pages) ETC1

7 / 7 page

7. Switch Handling Precautions

7.1 In case an automatic flow soldering apparatus is used for soldering, adhere to the following

conditions:

It e m

S o l d e r i n g c o ndit i o n

7.1.1. Preheat Temperature

100℃ max

(Ambient temperature of printed circuit board on

its soldering side)

7.1.2. Preheat Time

45 sec max.

7.1.3. Flux Foaming

To such an extent that fluxes will be kept flush with

the printed circuit board‘s top surface on which

components are mounted.

Preparatory flux must not be applied to that side of

printed circuit board on which components are

mounted and to the area where terminals located.

7.1.4. Soldering Temperature

255℃ max.

7.1.5. Duration of Solder Immersion

5 sec. max.

7.1.6. Allowable Frequency of Soldering process

2 times max.

7.2 Other precautions

7.2.1. Following the soldering process, do not try to clean the switch with a solvent or the like.

7.2.2. Safeguard the switch assembly against flux penetration from its topside.

7.2.3. Please have the products keep in close status and the storage time is 90 days guaranty after

delivering the goods at most.

PART NO:

TS6601H

6/6

TS6601H 数据表(PDF) 7 Page - List of Unclassifed Manufacturers