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PIU3D15-R50N 数据表(PDF) 14 Page - AiT Semiconductor Inc. |
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PIU3D15-R50N 数据表(HTML) 14 Page - AiT Semiconductor Inc. |
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14 / 14 page ![]() AiT Semiconductor Inc. www.ait-ic.com POWER INDUCTOR PIU ●SMT POWER INDUCTOR ENVIRONMENTAL SPECIFICATIONS General Items Specifications Shelf Storage conditions Temperature range: 25±3 ℃; Humidity: <80% relative humidity. Recommended product should be used within six months from the time of delivery. Environmental test Test Items Specifications Test Conditions / Test Methods High temperature Storage test No case deformation or change in appearance. △ L/L ≦10% Temperature 85±2 ℃, Time: 48±2 hours, Tested after 1hour at room temperature. Low temperature Storage test Temperature -25±2 ℃, Time: 48±2 hours, Tested after 1hour at room temperature. Humidity test Temperature 40±2 ℃, 90~95% relative humidity Time: 96±2 hours Tested after 1hour at room temperature. Thermal shock test First is -25 ℃ 30minutes then 25℃ 10 minutes last 85 ℃ 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. Mechanical test Test Items Specifications Test Conditions / Test Methods Solderability test Terminal area must have 90% minimum solder coverage. Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245±5 ℃ for 3 seconds. Resistance to Soldering Heat No case deformation or change in appearance. Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130~150 ℃. Immersing to 260±5℃ for 10 seconds. Vibration test No case deformation or change in appearance. △ L/L ≦10% Apply frequency 10~55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. Shock resistance Drop down with 981m/s 2(100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. The condition of reflow (recommendation): |
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