CYStech Electronics Corp.

Spec. No. : C333SA

Issued Date : 2003.05.21

Revised Date :

Page No. : 3/3

CSMA320-3100SA

CYStek Product Specification

SMA/DO-214AC Dimension

*:Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.177

0.185

4.4

4.8

E

0.060

0.067

1.5

1.7

B

0.094

0.110

2.4

2.8

F

0.04(typ)

1.0(typ)

C

0.012(typ)

0.3(typ)

G

0.04(typ)

1.0(typ)

D

0.150

0.165

3.8

4.2

-

-

-

-

-

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

B

A

C

D

E

F

G

SMA Plastic Surface

Mounted Package

CYStek Package Code:SA

Marking Code:

320

CSMA

330

CSMA

340

CSMA

350

Code

SS32

SS33

SS34

SS35

360

CSMA

380

CSMA

3100

Code

SS36

SS38

S310