ADP5585ACBZ-04-R7 datasheet(37/40 Pages) AD

37 / 40 page

Data Sheet

ADP5585

Rev. C | Page 37 of 40

OUTLINE DIMENSIONS

0.545

0.500

0.455

SIDE VIEW

0.230

0.200

0.170

0.300

0.260

0.220

COPLANARITY

0.05

SEATING

PLANE

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

BALL A1

IDENTIFIER

0.40

REF

1.20

REF

1.630

1.590 SQ

1.550

Figure 28. 16-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-16-10)

Dimensions shown in millimeters

3.10

3.00 SQ

2.90

0.30

0.23

0.18

1.75

1.60 SQ

1.45

0.50

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

0.50

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.80

0.75

0.70

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

Figure 29. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 x 3 mm Body, Very Very Thin Quad

(CP-16-22)

Dimensions shown in millimeters

ADP5585ACBZ-04-R7 数据表(PDF) 37 Page - Analog Devices

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