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Vishay Electro-Films

Revision: 14-Sep-2018

2

Document Number: 61112

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

FRONT TO BACK CONTINUITY

For designs requiring metal or electrical connection from the top to the bottom of the substrate, metal via connections will be

used. Metalized Edge Wraps are chosen for applications where soldering to the side of the substrate is desired for connection

to the PCB or module design. Plated thru-holes are used for applications where the module design may require alignment or

soldering pins to be inserted into the holes. Filled vias are used for applications where the strongest electrical connection is

needed or preventing solder migration to the backside. See Fig. 1 below for edge wrap, plated thru-hole, and filled via pictorial

representation.

Note

• These rules apply to the non-vented via side

Fig. 1

METALLIZED EDGE WRAPS

Min. distance from wrap edge to pattern edge

0.005"

Min. tolerance from wrap center to pattern edge

± 0.002"

Wrap diameter (as measured from exit side)

0.8 to 2.0 x substrate thickness

PLATED THRU-HOLES

Min. distance from hole edge to pattern edge

0.005"

Min. tolerance from hole center to pattern edge

± 0.002"

Hole diameter (as measured from exit side)

0.8 to 2.0 x substrate thickness

Min. hole center to hole center spacing

2 x hole diameter

FILLED VIAS

Min. distance from via edge to pattern edge

0.0025"

Min. tolerance from via center to pattern edge

± 0.002"

Min. via center to via center spacing

2 x via diameter

Preferred via diameter (as measured from exit side)

0.8 x substrate thickness

Via diameter range (as measured from exit side)

0.6 - 1.5 x substrate thickness

Min. via diameter

0.007"

Max. via diameter

0.040"

Edge wrap

Plated thru-hole

Filled via