MF-ASML/X Series - Low Ohmic PTC Resettable Fuses

Solder Reflow Recommendations

TP

TP

tp

t s

TTO

RAMP-UP

L

TL

t L

25

Ts max

Ts min

PREHEAT

Time

CRITICAL ZONE

RAMP-DOWN

t 25 °C TO PEAK

Notes:

•

MF-ASML/X models are intended for reflow soldering (including, but

not limited to heating plate, hot air, IR, nitrogen, and vapor phase).

•

Wave soldering is permissible only if the device is on the top of the

PCB, opposite the heat source.

•

Hand soldering is not recommended for these devices.

•

All temperatures refer to the topside of the device, measured on the

device body surface.

•

If reflow temperatures exceed the recommended profile, devices may

not meet the published specifications.

•

Compatible with Pb and Pb-free solder reflow profiles.

•

Excess solder may cause a short circuit.

•

Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering

Recommendations document for more details.

Profile Feature

Pb-Free Assembly

3 °C / second max.

PREHEAT:

150 °C

200 °C

60~180 seconds

TIME MAINTAINED ABOVE:

217 °C

60~150 seconds

260 °C

20~40 seconds

Ramp-Down Rate

6 °C / second max.

Time 25 °C to Peak Temperature

8 minutes max.

Typical Part Marking

No marking.

How to Order

MF - ASML 050 / 6 - 2

Product Designator

Series

ASML = 0402 Low Ohmic

Surface Mount Component

Hold Current, Ihold

010 - 050 (0.10 Amps - 0.50 Amps)

Maximum Voltage, Vmax

6 = 6 Volts

Packaging

-2 = Tape and Reel

Packaged per EIA-481

Packaging Quantity

10,000 pcs. per reel

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.