[2SMPB-02E] Datasheet Rev.05(Jun.,2017)

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Copyright 2017 OMRON Corporation. All Rights Reserved.

Table of Contents

1. Ratings, Specifications and Functions......................................................................................................3

1.1 Use conditions and recommended operating conditions ................................................ 3

1.2 Absolute Maximum Ratings ................................................................................................. 3

1.3 Operating Ratings ................................................................................................................. 3

1.4 Electrical Characteristics ..................................................................................................... 3

1.5 Digital Interface Characteristics .......................................................................................... 4

1.6 Characteristics by Oversampling setting

(Force mode) ................................................ 4

1.7 rms Noise by IIR Filter Selection ......................................................................................... 4

1.8 Bandwidth by IIR Filter Selection ........................................................................................ 5

1.9 Filter selection based on use cases.................................................................................... 5

2. Connection....................................................................................................................................................6

2.1 Block Diagram ....................................................................................................................... 6

2.2 Pin Description and Layout.................................................................................................. 6

2.3 Typical Connection Diagram................................................................................................ 7

3. Dimensions ...................................................................................................................................................8

3.1 Package .................................................................................................................................. 8

3.2 Mounting PAD Dimensions .................................................................................................. 8

3.3 Marking structure .................................................................................................................. 8

4. Operations.....................................................................................................................................................9

4.1 Communication Mode........................................................................................................... 9

4.2 Power Mode ........................................................................................................................... 9

4.3 Compensation of Pressure and Temperature .................................................................. 10

4.4 Implementing Register List ................................................................................................ 12

4.5 I²C Protocol .......................................................................................................................... 15

4.6 SPI Protocol ......................................................................................................................... 16

4.7 Interface specifications ...................................................................................................... 17

4.8 Reset Function .................................................................................................................... 19

4.9 Recommended conditions of communication................................................................. 19

5. Packaging....................................................................................................................................................20

5.1 Configuration of shipment ................................................................................................. 20

5.2 Taping ................................................................................................................................... 20

5.3 Reel ....................................................................................................................................... 21

5.4 Individual packaging........................................................................................................... 21

6. Recommended Soldering Method ............................................................................................................22

7. Precautions .................................................................................................................................................22

8. Warranty and Limited Warranty ................................................................................................................23