SFSKB3M80GF00-R1 datasheet(55/77 Pages) MURATA1

55 / 77 page

Notice

Continued on the following page.

Filter is soldered twice within the following temperature

conditions.

1. Standard Reflow Soldering Conditions

(1) Reflow

Filter is soldered at +350±5°C for 3.0±0.5 seconds. The

soldering iron should not touch the filter while soldering.

(2) Soldering Iron

The component is recommended for use with placement

machines that employ optical placement capabilities. The

component might be damaged by excessive mechanical

force. Please make sure that you have evaluated by

using placement machines before going into mass

production. Do not use placement machines that utilize

mechanical positioning. Please contact Murata for details

beforehand.

(3) Conditions for Placement Machines

(a) The component may be damaged if excess

mechanical stress is applied to it mounted on the

printed circuit board.

(b) Design layout of components on the PC board to

minimize the stress imposed on the warp or flexure of

the board.

applied to the circuit board, mechanical stress will

cause destruction resistance characteristics to

degrade. To prevent this, be extremely careful in

determining shape and dimension before designing

the circuit board diagram.

(d) When the positioning claws and pick-up nozzle are

worn, the load is applied to the components while

positioning is concentrated on positioning accuracy,

etc. Careful checking and maintenance are necessary

to prevent unexpected trouble.

(e) When correcting components with a soldering iron,

the tip of the soldering iron should not directly touch

the component. Depending on the soldering

conditions, the effective area of terminations may be

reduced. Solder containing Ag should be used to

prevent electrode erosion.

(f) Do not use strong acidity flux, more than 0.2wt%

chlorine content, in reflow soldering.

(4) Other

o Soldering and Mounting

100

230

260

30 sec.

min.

40 sec.

max.

Peak

(260°C max.)

Pre-heating

(150-180°C)

Heating

(230°C)

Gradual

Cooling

120 sec.

min.

60-120 sec.

[Component Direction]

[Component Layout Close to Board]

Place the

component

lateral to the

direction in

which stress

acts.

Susceptibility to

stress is in the order

of : A>C>B

Slit

Perforation

c CERAFILr 10.7MHz Chip Type SFECF Series

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical speciﬁcations. Therefore, please approve our product speciﬁcations or transact the approval sheet for product speciﬁcations before ordering.

SFSKB3M80GF00-R1 数据表(PDF) 55 Page - Murata Manufacturing Co., Ltd

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