AM9468 datasheet(13/16 Pages) DIODES

13 / 16 page

AM9468

Document number: DS38663 Rev. 1 - 2

13 of 16

www.diodes.com

May 2016

AM9468

Thermal Performance

TSSOP-16 Power Dissipation De-rating Curve 1 (Note 13)

TA (C)

-40

100

105

110

120

125

130

140

150

PD (mW) 3,520 3,520 3,520 2,816 2,534 2,253 1,971 1,830 1,690 1,549 1,408 1,267 1,126

845

704

563

282

Note 13:

TSSOP-16 is soldered on FR-4 substrate 4-layer 1.6mm thickness PCB board, calculated in accordance with JESD 51-7.

TSSOP-16 Power Dissipation De-rating Curve 2 (Note 14)

TA (C)

-40

100

105

110

120

125

130

140

150

PD (mW) 2,090 2,090 2,090 1,672 1,505 1,338 1,170 1,087 1,003

920

836

752

669

502

418

334

167

Note 14:

TSSOP-16 is soldered to the circular PCB diameter

1.2” with the center circular cutout diameter of 0.53”. The Hall element space cut-out is 0.12”x0.08”. 2-

layer 2oz.copper FR-4 PCB (1.6mm thickness) with partial copper flood on the bottom layer.

TSSOP-16 Thermal Derating Curve

AM9468 数据表(PDF) 13 Page - Diodes Incorporated

AM9468 数据表(HTML) 13 Page - Diodes Incorporated

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

数据表下载