30LV Series

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Vishay Cera-Mite

Revision: 30-Sep-2021

7

Document Number: 23103

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

STORAGE

The capacitors must not be stored in a corrosive atmosphere, where sulphide or chloride gas, acid, alkali or salt are present.

Exposure of the components to moisture, should be avoided. The solderability of the leads is not affected by storage of up to

24 months (temperature +10 °C to +40 °C, relative humidity up to 60 % RH). Class 2 ceramic dielectric capacitors are also

SOLDERING

SOLDERING RECOMMENDATIONS

Ceramic capacitors are very sensitive to rapid changes in temperature (thermal shock) therefore the solder heat resistance

specification (see table above) should not be exceeded. Exposing the capacitor to excessive heating may result in thermal

shocks that can crack the ceramic body. Similarly, excessive heating can cause the internal solder junction to melt.

When soldering radial leaded ceramic capacitors with a soldering iron, it should be performed under the following conditions

and should not exceed:

• Maximum temperature of iron-tip: 400 °C

• Maximum soldering iron wattage: 50 W

• Maximum soldering time: 3.5 s

Failure to follow the above cautions may result, in worst case, in short circuit or cause fuming or thermo-mechanical damage

when the product is used.

Leaded ceramic capacitors are not designed for reflow process or dipping the body into a solder melt.

CLEANING

The components should be cleaned immediately following the soldering operation with vapor degreasers.

CLEANING (ULTRASONIC CLEANING)

To perform ultrasonic cleaning, observe the following conditions:

• Maximum rinse bath capacity output: 20 W/liter

• Maximum rinsing time: 300 s

• Do not vibrate the PCB/PWB directly

• Excessive ultrasonic cleaning may lead to mechanical damage

SOLVENT RESISTANCE

The coating and marking of the capacitors are resistant to the following test method:

IEC 60068-2-45 (method XA)

MOUNTING

We do not recommend modifying the lead terminals, e.g. bending or cropping. This action could break the coating or crack the

ceramic insert. In order to avoid such failures we are offering different lead wire designs (e.g. straight, inline, inside crimp,

outside crimp etc.) If however, the lead must be modified in any way, we recommend support of the lead with a clamping fixture

next to the coating. If a defined product stop is required for mounting on a PCB, a mechanically formed product stop or a

mounting tool should be used.

SOLDERING SPECIFICATIONS



Soldering test for capacitors with wire leads: (according to IEC 60068-2-20, solder bath method)

SOLDERABILITY

RESISTANCE TO SOLDERING HEAT

Soldering temperature

(235 ± 5) °C

(260 ± 5) °C

Soldering duration

(2 ± 0.5) s

(10 ± 1) s

Distance from component body

 2 mm

 5 mm