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MN1380 Series

Microcomputer Peripheral LSIs

Reliability Testing Results for MN1380 Series

(1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812)

Test Subjects

Test Conditions

Results

Operating lifetime test

0/15

High-temperature storage test

Ta=150˚C, t=1000hrs

0/15

Low-temperature storage test

Ta=–65˚C, t=1000hrs

0/15

High-temperature,

Ta=85˚C, RH=85%, t=1000hrs

0/15

high-humidity storage test

High-temperature,

0/15

high-humidity bias test

Thermal shock test

Ta=150˚C and –65˚C.

0/15

Five minutes at each temperature for ten cycles

Temperature cycle test

Ta=150˚C and –65˚C.

0/15

Thirty minutes at each temperature for ten cycles

Pressure cooker test

Two atmospheres for 50 hours at ambient temperature (Ta) of 121˚C

0/15

Soldering test

Ambient temperature (Ta) of 230˚C for five seconds

0/15

Solder heat resistance test

Ambient temperature (Ta) of 270˚C for ten seconds

0/15

(2) Mini type package (MN1382/MN13821/MN13822)

Test Subjects

Test Conditions

Results

Operating lifetime test

0/15

High-temperature storage test

Ta=150˚C, t=1000hrs

0/15

Low-temperature storage test

Ta=–65˚C, t=1000hrs

0/15

High-temperature,

Ta=85˚C, RH=85%, t=1000hrs

0/15

high-humidity storage test

High-temperature,

0/15

high-humidity bias test

Thermal shock test

Ta=150˚C and –65˚C.

0/15

Five minutes at each temperature for ten cycles

Temperature cycle test

Ta=150˚C and –65˚C.

0/15

Thirty minutes at each temperature for ten cycles

Pressure cooker test *1

Two atmospheres for 24 hours at ambient temperature (Ta) of 121˚C

0/15

Soldering test

Ambient temperature (Ta) of 230˚C for five seconds

0/15

Solder heat resistance test *1

Ambient temperature (Ta) of 260˚C for five seconds

0/15

Note*1: Note that the testing conditions for the mini package differ from those for the other two packages.