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STM32F103ZCT7XXX 数据表(PDF) 121 Page - STMicroelectronics |
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STM32F103ZCT7XXX 数据表(HTML) 121 Page - STMicroelectronics |
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121 / 143 page  DS5792 Rev 13 121/143 STM32F103xC, STM32F103xD, STM32F103xE Package information 135 Figure 69. WLCSP64 - 64-ball, 4.4757 x 4.4049 mm, 0.5 mm pitch wafer level chip scale package recommended footprint b(2) 0.290 0.320 0.350 0.0114 0.0126 0.0138 e - 0.500 - - 0.0197 - e1 - 3.500 - - 0.1378 - F - 0.447 - - 0.0176 - G - 0.483 - - 0.0190 - D 4.446 4.466 4.486 0.1750 0.1758 0.1766 E 4.375 4.395 4.415 0.1722 0.1730 0.1738 H - 0.250 - - 0.0098 - L - 0.200 - - 0.0079 - eee - 0.05 - - 0.0020 - aaa - 0.10 - - 0.0039 - Number of balls 64 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum ball diameter parallel to primary datum Z. Table 70. WLCSP64 recommended PCB design rules (0.5 mm pitch) Dimension Recommended values Pitch 0.5 Dpad 250 µm Dsm 300 µm Stencil Opening 320 µm Table 69. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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