HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet

T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps

Broadcom

AV02-0373EN

13

Precautions

Lead Forming



The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.



For better control, use the proper tool to precisely form

and cut the leads to the applicable length rather than

doing it manually.



If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground that prevents mechanical stress

due to lead cutting from traveling into LED package.

Use this method for hand soldering operation, because

the excess lead length also acts as small heat sink.

Soldering and Handling



Take care during the PCB assembly and soldering

process to prevent damage to the LED component.



The LED component may be effectively hand soldered

to PCB; however, do this only under unavoidable

circumstances, such as rework. The closest manual

soldering distance of the soldering heat source

(soldering iron’s tip) to the body is 1.59 mm. Soldering

the LED using soldering iron tip closer than 1.59 mm

might damage the LED.



Properly apply ESD precautions on the soldering

station and personnel to prevent ESD damage to the

LED component that is ESD sensitive. Refer to

soldering iron used should have a grounded tip to

ensure electrostatic charge is properly grounded.



Recommended soldering condition:



Set and maintain wave soldering parameters according

to the recommended temperature and dwell time.

Perform daily checks on the soldering profile to ensure

that it conforms to the recommended soldering

conditions.

NOTE:

1. PCBs with different sizes and designs

(component density) will have different heat

mass (heat capacity). This might cause a

change in temperature experienced by the

board if the same wave soldering setting is

used. Therefore, recalibrate the soldering

profile again before loading a new type of PCB.

2. Broadcom’s AllnGaP high-brightness LEDs

use a high-efficiency LED die with a single wire

bond as shown below. Take extra precautions

during wave soldering to ensure that the

maximum wave temperature does not exceed

250°C and the solder contact time does not

exceed 3s. Overstressing the LED during the

soldering process might cause premature

failure to the LED due to delamination.

Broadcom LED Configuration

Figure 11: LED Configuration

NOTE: Electrical connection between the bottom surface

of the LED die and the lead frame is achieved

through conductive paste.



Loosely fit any alignment fixture that is being applied

during wave soldering and do not apply weight or force

on the LED. Use nonmetal material because it absorbs

less heat during the wave soldering process.



At elevated temperatures, the LED is more susceptible

to mechanical stress. Therefore, allow the PCB to cool

down to room temperature prior to handling, which

includes removal of alignment fixture or pallet.

Wave

a. Above conditions refer to measurement with thermocouple

mounted at the bottom of PCB.

b. It is recommended to use only bottom preheaters in order to

reduce thermal stress experienced by LED.

Manual Solder

Dipping

Pre-heat temperature

105°C max.

—

Preheat time

60s max.

—

Peak temperature

250°C mMx.

260°C max.

Dwell time

3s max.

5s max.

1.59mm

CATHODE