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LEOLVDSRD 数据表(PDF) 8 Page - STMicroelectronics

部件名 LEOLVDSRD
功能描述  Rad-hard plastic LVDS driver-receiver
PDF  23 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

LEOLVDSRD 数据表(HTML) 8 Page - STMicroelectronics

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Symbol
Parameters
Test conditions
Min.
Typ.
Max.
Unit
TPZH
Load: refer to Figure 7. Enable and
disable waveforms for the receiver
ns
Propagation delay time, high
impedance to high level output
3.8
TPZL
Propagation delay time, high
impedance to low level output
3.8
TD1
Fail-safe to active time
1
µs
TD2
Active to fail-safe time
1
µs
1. TSK is the maximum delay time difference between outputs of all devices when they operate with the same supply voltage, at the same
temperature.
2. Guaranteed by design and characterization
3. TSKD is the maximum delay time difference between TPHLD and TPLHD.
Cold sparing:
The LEOLVDSRD features a cold spare input and output buffer. In high reliability applications, cold sparing
enables a redundant device to be tied to the data bus with its power supply at 0 V (VCC = GND) without affecting
the bus signals or injecting current from the I/Os to the power supplies. Cold sparing also allows redundant
devices to be kept powered off so that they can be switched on only when required. This has no impact on
the application. Cold sparing is achieved by implementing a high impedance between the I/Os and VCC. ESD
protection is ensured through a non-conventional dedicated structure.
Fail-safe:
In many applications, inputs need a fail-safe function to avoid an uncertain output state when the inputs are not
connected properly. In case of an LVDS input short-circuit or floating input, the LVCMOS output remains in stable
logic-high state.
LEOLVDSRD
Electrical characteristics
DS13673 - Rev 4
page 8/23



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