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RF2L42008CG2 数据表(PDF) 3 Page - STMicroelectronics |
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RF2L42008CG2 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 12 page ![]() 2 Electrical characteristics TC = 25 °C unless otherwise specified. Table 4. Static Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage VGS = 0 V, IDS = 100 µA 65 V IDSS Zero-gate voltage drain current VGS = 0 V, VDS = 28 V 1 μA VGS = 0 V, VDS = 50 V IGSS Gate-body leakage current VGS = -6/10 V, VDS = 0 V ±100 nA VGS(th) Gate threshold voltage VDS = 28 V, IDS = 300 μA 1.75 2.50 V VGS(Q) Gate quiescent voltage VDS= 1 V, IDS= 100 mA 2 4 V VDS(on) Static drain-source on-voltage VGS = 10 V, IDS = 800 mA 1.1 V RDS(on) Drain-source on-state resistance VGS = 10 V, VDS=100 mV 1.5 Ω IDS(on) Static drain-source on-current 2.5 A Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit f Frequency 700 4200 MHz POUT Output power f = 3600 MHz, pulsed CW 8 W GPS Power gain 14.5 dB ƞD Drain efficiency 47 % VSWR Load mismatch at 8 W pulsed CW output power, all phases 10:1 Note: VDD = 28 V, IDQ = 85 mA, pulse width = 100 μs, duty cycle = 10%. RF2L42008CG2 Electrical characteristics DS13240 - Rev 3 page 3/12 |
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