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STIB1560DM2T-LZ 数据表(PDF) 10 Page - STMicroelectronics |
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STIB1560DM2T-LZ 数据表(HTML) 10 Page - STMicroelectronics |
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10 / 23 page ![]() 4 Fault management The device integrates an open-drain output connected to the SD pin. As soon as a fault occurs, the open-drain is activated and the LVGx outputs are forced low. Two types of fault can be identified: • Overcurrent (OC) sensed by the internal comparator (see more detail in Section 4.1 Smart shutdown function); • Undervoltage on supply voltage (VCC) Each fault enables the SD open drain for a different time, as described in the following table. Table 11. Fault timing Symbol Parameter Event time (1) SD open-drain enable time result (1)(2) OC Over-current event ≤ 24 μs 24 μs > 24 µs OC time UVLO Under-voltage lockout event ≤ 70 μs 70 µs > 70 µs until the VCC_LS exceeds the VCC_LS UV turn ON threshold UVLO time 1. Typical value (-40 °C ≤ TJ ≤ +125 °C). 2. Without contribution of the RC network on SD. Actually, the device remains in a fault condition (SD at low logic level and LVGx outputs disabled) for a time also depending on the RC network connected to the SD pin. The network generates a time contribution that is added to the internal value. Figure 4. Overcurrent timing (without contribution of the RC network on SD) GIPG120520141638FSR STIB1560DM2T-LZ Fault management DS13556 - Rev 1 page 10/23 |
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