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SF-0603SPA-R 数据表(PDF) 4 Page - Bourns Electronic Solutions

部件名 SF-0603SPA-R
功能描述  SF-0603SPA-R SeriesAutomotive Grade SMD Fuses
PDF  5 Pages
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制造商  BOURNS [Bourns Electronic Solutions]
网页  http://www.bourns.com
标志 BOURNS - Bourns Electronic Solutions

SF-0603SPA-R 数据表(HTML) 4 Page - Bourns Electronic Solutions

  SF-0603SPA-R Datasheet HTML 1Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 2Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 3Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 4Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 5Page - Bourns Electronic Solutions  
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Solder Reflow Recommendations
Profile Feature
Pb-Free Assembly
Preheat / Soak:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (ts) from (Tsmin to Tsmax)
150 °C
200 °C
60~120 seconds
Ramp Up Rate (TL to Tp)
3 °C / second max.
Liquidous Temperature (TL)
Time (tL) maintained above TL
217 °C
60~150 seconds
Peak Package Body
Temperature (Tp)
260 °C
Time (tp)* within 5 °C of the
specified classification temperature (Tc) 30 seconds*
Ramp Down Rate (Tp to TL)
6 °C / second max.
Time 25 °C to Peak Temperature
8 minutes max.
TIME
tL
TIME 25 °C TO PEAK
tp
ts
Tsmax
Tsmin
Tp
260
150
10 sec. max.
PREHEATING
TL
25
Tc -5 °C
PREHEAT AREA
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
120 seconds
TIME
* Tolerance for peak profile temperature (Tp) is defined as a
supplier minimum and a user maximum.
SF-0603SPA-R Series – Automotive Grade SMD Fuses
Test Items
Reference Standard
Solderability
J-STD-002; Condition B
Resistance to Soldering Heat
MIL-STD-202; Method 210;
Condition B
Moisture Resistance
MIL-STD-202; Method 106
Thermal Shock
MIL-STD-202; Method 107;
Condition B
Mechanical Shock
MIL-STD-202; Method 213;
Condition A
Vibration
MIL-STD-202; Method 201
Terminal Strength
IEC 60115-1 4.32
High Temperature Storage
MIL-STD-202; Method 108
Temperature Cycling
JESD22 Method JA-104,
Test Conditions B and N
Bias Humidity
MIL-STD-202; Method 103
Operational Life
MIL-STD-202; Method 108;
Condition D
Resistance to Solvent
MIL-STD-202; Method 215
Board Flex (Bending)
AEC-Q200-005
Carrying Capacity
UL 248-14
Fusing Time
UL 248-14
Interrupting Ability
UL 248-14
Temperature Rise
UL 248-14
Residual Resistance
UL 248-14
Low Temperature Storage
JESD22-A119
Reliability Tests
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
03/22



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