6

Soldering guidelines

The soldering profile depends on the number, size and placement of components on the application board. For

this reason, it is not possible to define a unique soldering profile for the sensor only. The customer should use a

time and temperature reflow profile based on PCB design and manufacturing expertise. In any case, the soldering

profile should not exceed profiles as specified in Jedec J-STD-020.

LGA packages show metal traces on the side of the package so solder material must be avoided on the side of

package during reflow.

The product package is not sealed as there is a 0.1 mm hole on the bottom of the package as illustrated in

Figure 7. OLGA-10L (3.2 x 4.2 x 1.455 mm) package outline and mechanical data. A dry reflow process such as

convection reflow is recommended. Vapor phase reflow is not suitable for this type of optical component.

‘No-wash’ assembly process has to be used. “Self-cleaning” / “no flux” solder paste are to be used.

The product top surface can be eventually protected by suitable tape during reflow and other manufacturing steps

to avoid contamination or scratches on the optical filter section of the component.

For land pattern and soldering recommendations, consult technical note TN0018 available on www.st.com.

STHS34PF80

Soldering guidelines

DB4312 - Rev 1

page 9/13