Figure 7. Forward voltage drop versus forward current

(per diode)

IF(A)

0.1

1.0

10.0

100.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

Tj = 125 °C

(typical values)

Tj = 125 °C

(maximum values)

Tj = 25 °C

(maximum values)

VF(V)

Figure 8. Thermal resistance junction to ambient versus

copper surface under tab

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

Rth(j-a) (°C/W)

D²PAK

Epoxy printed board FR4, copper thickness = 35 µm

SCu(cm²)

STPS40150C

Characteristics (curves)

DS3262 - Rev 2

page 4/15