Rev Date: 5/12/2022

4

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Please confirm technical specifications before you order and/or use.

HCS Series

High Current Metal Element Shunt Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

Function Performance Characteristics

Environmental Performance Characteristics (cont.)

Test

Test Specification

Test Condition

The part shall be immersed into the flux specified in the solder bath

235ºC ± 5ºC for 2 seconds ± 0.5 seconds. It shall be immersed to a point

10 mm from its root.

(Sn96.5/Ag3.0/Cu0.5) (JIS-C5 202 6.11)

Solderability

Note: The terminal temperature of component should be below 100ºC.

Mount the chip to test 90 mm (L)*40 mm (W) FR4 printed circuit board

substrate. Apply pressure in direction of arrow unit band width reaches

2 mm (+0.2 / -0 mm) illustrated in the picture below and hold for 10 ± 1

seconds (JIS-C5202-6.1)

Bending Strength

ΔR: ± (1% + 0.0005Ω)

Solder shall cover 95% or more

of the electrode area

Test

Test Specification

Test Condition

Operating temperature range is -55°C to +170°C

Storage condition is 22°C to 28°C, humidity is of 40% to 75%.

The chip (mounted on board) is exposed, - 55 ± 3ºC (30 min) / +125 ± 2ºC

(30 minutes) for 5 cycles. The following conditions as the figure below.

(JIS_C5202-7.4)

Rapid Change of Temperature

ΔR: ± (1% + 0.0005Ω)