Rev Date: 4/18/2022

3

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This specification may be changed at any time without prior notice.

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Please confirm technical specifications before you order and/or use.

HCSM Series

High Power Metal Element Current Shunt Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

Function Performance Characteristics (cont.)

Taping Specifications

– Embossed Plastic Tape

Recommended Pad Layouts

Test

Test Method

Test Specification

Test Condition

JIS-C5202-6.11

The chip shall be immersed into the flux specified in the solder bath

235°C ± 5°C for 2 ± 0.5 seconds.

It shall be immersed to a point 10mm from its root.

(Sn96.5/Ag3.0/Cu0.5)

Solderability

Note: 5W with total solder pad trace size of 500 mm

2. The surface temperature of component should be below 100°C.

Solder shall cover 95%

or more of the

electrode area

Type/Code

Unit

0.205 ± 0.004

0.303 ± 0.004

0.069 ± 0.004

0.295 ± 0.004

0.630 ± 0.012

0.012 ± 0.002

inches

5.21 ± 0.10

7.69 ± 0.10

1.75 ± 0.10

7.50 ± 0.10

16.00 ± 0.30

0.30 ± 0.05

mm

Unit

0.157 ± 0.004

0.315 ± 0.004

0.079 ± 0.004

0.059 ± 0.004

0.059 ± 0.004

inches

4.00 ± 0.10

8.00 ± 0.10

2.00 ± 0.10

1.50 ± 0.10

1.50 ± 0.10

mm

t

HCSM2818

P0

P1

P2

D0

D1

W

A

B

E

F

Type/Code

a

b

c

d

Unit

0.138

0.209

0.020

0.024

inches

3.50

5.30

0.50

0.60

mm

HCSM2818