Rev Date: 08/30/2019

7

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This specification may be changed at any time without prior notice

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Please confirm technical specifications before you order and/or use.

LPC Series

SMD Unshielded Power Inductor

Stackpole Electronics, Inc.

Resistive Product Solutions

LPC

Unshielded SMD Power Inductor

SMD

YES

100% Matte Sn

Aug-05

05/31

Standard

Product

Series

Description

Package /

Termination

Type

Standard

Series

RoHS

Compliant

Lead-Free Termination

Composition

Lead-Free

Mfg. Effective Date

(Std Product Series)

Lead-Free

Effective Date

Code

(YY/WW)

Reflow Chart:

RoHS Compliance

Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various

regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances”

(RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our

compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as

amended by Directive (EU) 2015/863/EU as regards the list of restricted substances.

“Conflict Metals” Commitment

We at Stackpole Electronics, Inc. are joined with our industry in opposing the use of metals mined in the “conflict region” of the eastern

Democratic Republic of the Congo (DRC) in our products. Recognizing that the supply chain for metals used in the electronics industry

is very complex, we work closely with our own suppliers to verify to the extent possible that the materials and products we supply do

not contain metals sourced from this conflict region. As such, we are in compliance with the requirements of Dodd-Frank Act regarding

Conflict Minerals.

Mechanical Tests

RoHS Compliance Status

Test

Test Specification

Test Condition

Vibration Test

Apply frequency 10 ~ 55 Hz 1.5 mm amplitude in each of

perpendicular direction for 2 hours

Shock Resistance

Drop down with 981 m/s

2 (100 G) shock attitude upon a

rubber block method shock testing machine for

1 time in each of three orientations.

No case deformation or change in

appearance

Δ L/L ≤ 10%

Dip pads in flux then dip in solder pot (Sn(CuNi) at 24 ± 5 °C

for 3 seconds

Solderability Test

Terminal area must have 90%

minimum solder coverage

Resistance to Soldering Heat

No case deformation or change in

appearance

Flux should cover the whole of the sample before heating, then be

preheated for about 2 minutes over temperature of 130 ~ 150 °C.

immersing to 260 ± 5°C for 10 seconds