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PS5022MT101 数据表(PDF) 5 Page - Stackpole Electronics, Inc. |
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PS5022MT101 数据表(HTML) 5 Page - Stackpole Electronics, Inc. |
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5 / 6 page ![]() Rev Date: 09/18/2019 5 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. LPS Series SMD Shielded Power Inductor Stackpole Electronics, Inc. Resistive Product Solutions LPS Shielded SMD Power Inductor SMD YES 100% Matte Sn Aug-05 05/31 Lead-Free Effective Date Code (YY/WW) Standard Product Series Description Package / Termination Type Standard Series RoHS Compliant Lead-Free Termination Composition Lead-Free Mfg. Effective Date (Std Product Series) Reflow Chart: RoHS Compliance Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances” (RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as amended by Directive (EU) 2015/863/EU as regards the list of restricted substances. Mechanical Test RoHS Compliance Status Test Test Specification Test Condition Product with lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds Vibration Test Apply frequency 10 ~ 55 Hz 1.5 mm amplitude in each of perpendicular direction for 2 hours Shock Resistance Drop down with 981 m/s 2 (100 G) shock attitude upon a rubber block method shock testing machine for 1 time in each of three orientations. Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. immersing to 260 ± 5°C for 10 seconds No case deformation or change in appearance Δ L/L ≤10% Solderability Test Terminal area must have 90% minimum solder coverage Resistance to Soldering Heat No case deformation or change in appearance |
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