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L99VR01 数据表(PDF) 29 Page - STMicroelectronics |
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L99VR01 数据表(HTML) 29 Page - STMicroelectronics |
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29 / 47 page ![]() 6 Package and PCB thermal data 6.1 PowerSSO-12 Thermal data Figure 44. PowerSSO-12 PC board Note: layout condition of Rth and Zth measurements (PCB: Double layer and Four layers, Thermal Vias, FR4 area= 77 mm x 86 mm, PCB thickness=1.6 mm, Cu thickness=0.070 mm (front and back side), Cu thickness 0.035 mm (inner layers). Thermal vias separation 1.2 mm, Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 2.2 mm x 2.9 mm. L99VR01 Package and PCB thermal data DS13649 - Rev 3 page 29/47 |
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