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FDA802B 数据表(PDF) 9 Page - STMicroelectronics |
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FDA802B 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 12 page ![]() DocID030735 Rev 2 9/12 FDA802B Package information 12 VARIATIONS Pad option 6.0x6.0 (T1-T3)(3) D2 - - 6.61 E2 - - 6.61 D3 4.8 - - E3 4.8 - - 1. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusion is “0.25 mm” per side. 2. The Top package body size may be smaller than the bottom package size by much as 0.15 mm. 3. Number, dimensions and position of shown groves are for reference only: Table 3. LQFP64 (10x10x1.4 mm exp. pad up) package mechanical data (continued) Symbol Dimensions in mm Min. Typ. Max. |
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