AM9469

Document number: DS38810 Rev. 2 - 2

13 of 16

www.diodes.com

April 2018

© Diodes Incorporated

AM9469

Thermal Performance

TSSOP-16EP (Type DX) Power Dissipation De-rating Curve 1 (Note 13)

TA (°C)

-40

0

25

50

60

70

80

85

90

95

100

105

110

120

125

130

140

150

PD (mW) 3,520 3,520 3,520 2,816 2,534 2,253 1,971 1,830 1,690 1,549 1,408 1,267 1,126

845

704

563

282

0

Note:

13. TSSOP-16EP (Type DX) is soldered on FR-4 substrate 4-layer 1.6mm thickness PCB board, calculated in accordance with JESD 51-7.

TSSOP-16EP (Type DX) Power Dissipation De-rating Curve 2 (Note 14)

TA (°C)

-40

0

25

50

60

70

80

85

90

95

100

105

110

120

125

130

140

150

PD (mW) 2,090 2,090 2,090 1,672 1,505 1,338 1,170 1,087 1,003

920

836

752

669

502

418

334

167

0

Note:

14. TSSOP-16EP (Type DX) is soldered to the circular PCB diameter

1.2‖ with the center circular cutout diameter of 0.53‖. The Hall element space cut-out is

0.12‖x0.08‖. 2-layer 2oz.copper FR-4 PCB (1.6mm thickness) with partial copper flood on the bottom layer.

0

500

1000

1500

2000

2500

3000

3500

4000

-40

-20

0

20

40

60

80

100

120

140

160

Temperature T

A (°C)

TSSOP-16EP (Type DX) Thermal Derating Curve

Rthja = 35.71 oC/W

0

250

500

750

1000

1250

1500

1750

2000

2250

-40

-20

0

20

40

60

80

100

120

140

160

Temperature T

A (°C)

TSSOP16-EP Thermal Derating Curve

(Custom Circular PCB with Centre Hole Cut-Out)

Rthja = 60.14 oC/W

TSSOP-16EP (Type DX) Thermal Derating

Curve