Features

Automotive compliancy

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AEC-Q100 grade 2 ongoing

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Operating junction temperature: -40°C to 125°C

Ultra compact 1.5 megapixel image sensor

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Global shutter architecture, 3D stacked sensor 40 nm/65 nm

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2.61 µm x 2.61 µm BSI (backside illuminated) pixel

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1.5 megapixel monochrome sensor (1124 x 1364)

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Package: OBGA

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Size: 6.2 mm x 6.9 mm

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Matrix: 6 x 8 balls

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Ball pitch: 0.8 mm

Easy integration

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Embedded auto-exposure

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Programmable sequences of 4-frame contexts

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8 programmable GPIOs

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NIR (near infrared) illumination control outputs, synchronized with sensor

integration periods

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PWM (pulse-width modulation) control

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Master/Slave external frame start

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Automatic dark calibration

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Dynamic pixel-defective correction

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Image cropping

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Mirror/flip readout

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Binning and subsampling (x2 and x4)

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Typical power consumption 145 mW at 60 fps

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Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane

Unique image performance

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Peak quantum efficiency 24% @ 940 nm

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Linear dynamic range up to 60 dB

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Up to 88 frames per second at full resolution

Description

The VB56G4A is a 1.5 megapixel global shutter image sensor designed for

automotive driver monitoring applications.

Using pre-eminent 3D stacking and ST patented processes, the sensor performs

outstandingly in the near infrared region (940 nm). More precisely, thanks to backside

illumination technology and its excellent sensitivity, the VB56G4A can be operated

with one simple LED or VCSEL.

Order code

Description

VB56G4ACGK OBGA 6.2 mm x 6.9 mm

Automotive grade 1.5 megapixel backside illuminated global shutter image

sensor

VB56G4A

Data brief

DB4717 - Rev 1 - April 2022

For further information contact your local STMicroelectronics sales office.

www.st.com