ACS102-6T

1 Characteristics

5/11

Figure 7.

On-state characteristics (maximal

values)

Figure 8.

SO-8 junction to ambient thermal

resistance versus copper surface

under tab (PCB FR4, copper

thickness 35 µm)

Figure 9.

Relative variation of critical rate of

decrease of main current (di/dt)c

versus junction temperature

Figure 10. Relative variation of critical rate of

decrease of main current (di/dt)c vs

(dV/dt)c, with turn-off time < 20 ms

Figure 11. Relative variation of static dV/dt

versus junction temperature

Figure 12. Relative variation of the maximal

clamping voltage versus junction

temperature (min value)

0.01

0.10

1.00

10.00

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

T

V

R

Tj=25°C

Tj=125°C

0

20

40

60

80

100

120

140

160

0

50

100

150

200

250

300

R

SO-8

(dI/dt) [T ] / (dI/dt) [T =125 °C]

cc

jj

0

2

4

6

8

10

12

14

16

18

20

55

65

75

85

95

105

115

125

T (°C)

j

V

(dI/dt)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.1

1

10

100

V

0

1

2

3

4

5

6

7

8

25

50

75

100

125

V

0.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

-25

0

25

50

75

100

125

V