FSV340FP, FSV360FP

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2

THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1)

Symbol

Characteristic

Value

Unit

ΨJL

Typical Thermal Characteristics, Junction−to−Lead (Note 2)

10

°C/W

RqJA

Typical Thermal Resistance, Junction−to−Ambient

140

°C/W

1. Per JESD51−3 recommended thermal test board. Device mounted on FR−4 PCB, board size = 76.2 mm x 114.3 mm.

2. Thermocouple soldered at cathode lead.

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

VF

Forward Voltage

IF = 3 A

FSV340FP

−

−

0.52

V

FSV360FP

−

−

0.65

IR

Reverse Current

VR = 40 V

FSV340FP

−

−

160

mA

VR = 60 V

FSV360FP

−

−

100

Trr

Reverse Recovery Time

IF = 0.5 A, IR = 1 A,

Irr = 0.25 A

FSV340FP

−

12.37

−

ns

FSV360FP

−

10.62

−

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

ORDERING INFORMATION

Part Number

Top Mark

Package

Shipping†

FSV340FP

FC

SOD−123EP

(Pb−Free/Halogen Free)

3000 / Tape & Reel

FSV360FP

FD

SOD−123EP

(Pb−Free/Halogen Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.