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STO68N65DM6 数据表(PDF) 2 Page - STMicroelectronics |
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STO68N65DM6 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 15 page ![]() 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID(1) Drain current (continuous) at TC = 25 °C 55 A Drain current (continuous) at TC = 100 °C 35 IDM(2) Drain current (pulsed) 172 A PTOT Total power dissipation at TC = 25 °C 240 W dv/dt(3) Peak diode recovery voltage slope 100 V/ns di/dt(3) Peak diode recovery current slope 1000 A/μs dv/dt(4) MOSFET dv/dt ruggedness 100 V/ns Tstg Storage temperature range -55 to 150 °C TJ Operating junction temperature range °C 1. Referred to TO-247 package. 2. Pulse width is limited by safe operating area. 3. ISD ≤ 55 A, VDS (peak) < V(BR)DSS, VDD = 400 V. 4. VDS ≤ 520 V. Table 2. Thermal data Symbol Parameter Value Unit RthJC Thermal resistance, junction-to-case 0.52 °C/W RthJB Thermal resistance, junction-to-board(1) 43 °C/W Thermal resistance, junction-to-board(2) 22 1. When mounted on 1 inch² FR-4 pcb, standard footprint 2 Oz copper board. 2. When mounted on 40x40mm FR-4 pcb, 6 cm² 2 Oz copper board. Table 3. Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (pulse width limited by TJ max.) 9 A EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) 930 mJ STO68N65DM6 Electrical ratings DS13723 - Rev 1 page 2/15 |
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