B8-9

CASE D

0.060 (1.52)

0.075 (1.91)

0.030 (0.76)

0.100 (2.54) 4X

0.100 (2.54) 18X

1.000 (25.40)

1.000

(25.40)

CASE D

TOP VIEW

See Figure 13

for pin

configurations.

Materials

Header

Kovar/Nickel/Gold

Cover

Kovar/Nickel

Pins

Kovar/Nickel/Gold,

matched glass seal

Case dimensions in inches (mm)

Tolerance

±0.005 (0.13) for three decimal places

±0.01 (0.3) for two decimal places

unless otherwise specified

1.110 max

(28.19)

1.110 max

(28.19)

CAUTION

Maximum reflow temperature is 220

°C for a

maximum of 30 seconds. SN60, SN62, or SN63

are the recommended types of solder. See below

for Solder Mask instructions.

Hand soldering should not exceed 300

°C for 10

seconds per pin.

Cover marking is oriented with pin one

at the upper right corner.

Differently colored glass bead around pin one or dimple

in header (bottom or side of case) indicates pin one.

Straight Leads

(This view shows

straight leads.)

MGA Series: Screening – Standard, ES, or 883

0.010

(0.25)

0.135 ref.

(3.43)

Leads are solder dipped and lead

dimensions are prior to solder dip.

0.08

(2.0)

0.010 (0.25)

Bottom of lead to

bottom of case

0.055

(1.40)

0.070

(1.78)

1

1

TOP VIEW CASE D

1.400 ref. (35.56)

0.010

(0.25)

0.08

(2.0)

0.250 max.

(6.35)

0.50

(12.7)

2.115 ref. (53.72)

0.015

(0.38)

Seam seal

0.900 (22.86)

0.800 (20.32)

0.700 (17.78)

0.600 (15.24)

0.500 (12.70)

0.400 (10.16)

0.300 ( 7.62)

0.200 ( 5.08)

0.100 ( 2.54)

1.000 (25.40)

1

2

3

4

5

6

7

8

9

10

18

17

16

15

14

13

12

11

19

20

Gull Wing Leads

Option

Differently colored glass bead around pin one or dimple in

header (bottom or side of case) indicates pin one.

Cover marking is oriented with pin one at the upper right corner.

0.000

Solder Mask Notes

1. Pad dimensions are for the solder mask opening. Lead common to

each other can be connected underneath as desired.

2. Ground pins should be connected to the center pad for improved

grounding.

3. Center pad should not have a solder mask. Solder, copper, or Au/Ni

plate are preferred over solder for adhesive attach.

4. Solder coat to solder down converter.

5. If less rotation of case is desired, make the pad width 0.020inches

(0.51 mm). Pad length can be extended 0.010 inches (0.25 mm)

towards the case body and as-desired dimension away from the case

body.

6. Do not exceed 220°C as measured on the body of the converter (top

or bottom).

7. Attach the body of the case to the board with a thermally conductive

adhesive or SN60, 62, or 63 solder. The adhesive can be electrically

conductive as well. It can be applied as an underfill post solder or

dispensed and cured prior or during solder.

Note: Although every effort has been made to render the case drawings at actual size, variations in the printing process may cause some distortion. Please refer

to the numerical dimensions for accuracy.