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Multi Spider - ORG4572 Datasheet

Revision 3.0

November 23, 2014

TABLE 15 – SOLDERING PROFILE PARAMETERS

23.4. CLEANING

If flux cleaning is required, module is capable to withstand standard cleaning process in vapor

degreaser with the Solvon® n-Propyl Bromide (NPB) solvent and/or washing in DI water.

Avoid cleaning process in ultrasonic degreaser, since specific vibrations may cause performance

degradation or destruction of internal circuitry.

23.5. REWORK

If localized heating is required to rework or repair the module, precautionary methods are required to

avoid exposure to solder reflow temperatures that can result in permanent damage to the device.

23.6. ESD SENSITIVITY

This product is ESD sensitive device and must be handled with care.

23.7. SAFETY INFORMATION

Improper handling and use can cause permanent damage to the product.

23.8. DISPOSAL INFORMATION

This product must not be treated as household waste.

For more detailed information about recycling electronic components contact your local waste

management authority.

SYMBOL PARAMETER

MIN

TYP

MAX

UNIT

TC

Classification Temperature

245

°C

TP

Package Temperature

245

°C

TL

Liquidous Temperature

217

°C

TS

Soak/Preheat Temperature

150

200

°C

tS

Soak/Preheat Time

60

120

s

tL

Liquidous Time

60

150

s

tP

Peak Time

30

s