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Multi Spider - ORG4572 Datasheet

Revision 3.0

November 23, 2014

19.2. HOST PCB

FIGURE 15 – HOST PCB

19.3. RF TRACE

0.002

0.051

0.008

0.204

0.005

0.127

inch

millimeter

FIGURE 16 – TYPICAL MICROSTRIP PCB TRACE ON FR-4 SUBSTRATE

19.4. PCB STACK-UP

Signals

Signals or Power

Ground

CS

PS

LN

.

.

.

Ground

Ground

L2

Signals

{

controlled

impedance 50Ω

FIGURE 17 – TYPICAL PCB STACK-UP

19.5. PCB LAYOUT RESTRICTIONS

Switching and high-speed components, traces and vias must be kept away from ORG4572 module.

Signal traces to/from module should have minimum length.

Recommended minimal distance from adjacent active components is 3mm.

Ground pads must be connected to host PCB Ground with shortest possible traces or vias.

In case of tight integration constrain or co-location with adjacent high speed components like CPU or

memory, high frequency components like transmitters, clock resonators or oscillators, LCD panels or

CMOS image sensors, contact OriginGPS for application specific recommendations.