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ADR3625ARMZ-R7 数据表(PDF) 13 Page - Analog Devices |
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ADR3625ARMZ-R7 数据表(HTML) 13 Page - Analog Devices |
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13 / 21 page ![]() Data Sheet ADR3625 TERMINOLOGY analog.com Rev. 0 | 13 of 21 Dropout Voltage Dropout voltage (VDO), sometimes referred to as supply voltage headroom or supply output voltage differential, is defined as the minimum voltage differential between the input and output such that the output voltage is maintained to within 0.1% accuracy. VDO = (VIN – VOUT)MIN|IL = Constant Because VDO depends on the current passing through the device, it is always specified for a given load current. In series mode devices, the dropout voltage typically increases proportionally to the load current (see Figure 6). Line Regulation Line regulation refers to the change in output voltage in response to a given change in input voltage and is expressed in percent per volt, ppm per volt, or μV per volt change in input voltage. Load Regulation Load regulation refers to the change in output voltage in response to a given change in load current and is expressed in μV per mA, ppm per mA, or ohms of dc output resistance. Solder Heat Resistance Shift Solder heat resistance shift refers to the permanent shift in output voltage that is induced by exposure to reflow soldering and is ex- pressed as a percentage of the output voltage. This shift is caused by changes in the stress exhibited on the die by the package materials when these materials are exposed to high temperatures. This effect is more pronounced in lead-free soldering processes due to higher reflow temperatures. Solder heat resistance is calcu- lated after three solder reflow cycles to simulate the worst case conditions when assembling a two-sided PCB with surface-mount components with one additional rework cycle. The reflow cycles use the JEDEC standard reflow temperature profile. Temperature Coefficient The temperature coefficient (TCVOUT) relates the change in the output voltage to the change in the ambient temperature of the device, as normalized by the output voltage at 25°C. The TCVOUT for the ADR3625 is fully tested over three temperatures: –40°C, +25°C, and +125°C. Box Method The box method is represented by the following equation: TCVOUT= maxVOUTT1,T2,T3 −minVOUTT1,T2,T3 VOUTT2 × T3−T1 ×106 where: TCVOUT is expressed in ppm/°C. VOUT(Tx) is the output voltage at temperature Tx. T11 = –40°C. T22 = +25°C. T33 = +125°C. This box method ensures that TCVOUT accurately portrays the maximum difference between any of the three temperatures at which the output voltage of the device is measured. Thermal Hysteresis Thermal hysteresis (ΔVOUT_HYS) represents the change in the out- put voltage after the device is exposed to a specified temperature cycle. ΔVOUT_HYS is expressed as a difference in ppm from the nominal output. ΔVOUT_HYS=VOUT1_25°C−VOUT2_25°C VOUT1_25°C ×106ppm where: VOUT1_25°C is the output voltage at 25°C. VOUT2_25°C is the output voltage after temperature cycling. Long-Term Drift Long-term drift (ΔVOUT_LTD) refers to the shift in the output voltage vs. time. This is expressed as a difference in ppm from the nominal output. ΔVOUT_LTD= VOUTt1−VOUTt0 VOUTt0 ×106ppm where: VOUT(t0) is the VOUT at the starting time of the measurement. VOUT(t1) is the VOUT at the end time of the measurement. |
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