Figure 7. Junction capacitance versus reverse applied

voltage

0.01

0.1

1

10

1

10

100

1000

C (nF)

VR (V)

SMA4F5.0A

SMA4F33A

SMA4F70A

SMA4F188A

f = 1 MHz

Vosc = 30mVRMS

Tj = 25 °C

Figure 8. Leakage current versus junction temperature

1

10

100

1000

10000

25

50

75

100

125

150

175

IR (nA)

Tj (°C)

VR = VRM

VRM < 10V

VRM ≥ 10V

Figure 9. Peak forward voltage drop versus peak forward

current

0

1

10

100

0

0.5

1

1.5

2

2.5

3

3.5

IF (A)

VF (V)

single pulse

Tj = 25 °C

Tj = 175 °C

Figure 10. Thermal impedance junction to ambient versus

pulse duration

1

10

100

1000

0.01

0.1

1

10

100

1000

Zth(j-a) (°C/W)

tp (s)

Single pulse on recommended footprint.

Epoxy printed circuit board FR4, 70 µm Cu thickness

Figure 11. Thermal resistance junction to ambient versus copper area under each lead

0

20

40

60

80

100

120

140

160

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

Rth(j-a) (°C/W)

SCu (cm²)

Single pulse on recommended footprint.

Epoxy printed circuit board FR4, 70 µm Cu thickness

SMA4FxxA

Characteristics (curves)

DS12542 - Rev 4

page 5/13