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STP11NM80 数据表(PDF) 3 Page - STMicroelectronics |
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STP11NM80 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 22 page ![]() STB/F/I/P/W11NM80 Electrical ratings Doc ID 9241 Rev 11 3/22 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit D²PAK, I²PAK TO-220, TO-247 TO-220FP VDS Drain-source voltage (VGS = 0) 800 V VGS Gate-source voltage ±30 V ID Drain current (continuous) at TC = 25 °C 11 11 (1) 1. Limited only by the maximum temperature allowed A ID Drain current (continuous) at TC=100 °C 8 8 (1) A IDM (2) 2. Pulse width limited by safe operating area Drain current (pulsed) 44 44 (1) A PTOT Total dissipation at TC = 25 °C 150 35 W Derating factor 1.2 0.28 W/°C VISO Insulation withstand voltage (DC) 2500 V TJ Tstg Operating junction temperature Storage temperature -65 to 150 °C Table 3. Thermal data Symbol Parameter Value Unit D²PAK TO-220FP I²PAK TO-220 TO-247 Rthj-case Thermal resistance junction-case max 0.83 3.6 0.83 °C/W Rthj-a Thermal resistance junction- ambient max 62.5 50 °C/W Rthj-pcb (1) 1. When mounted on 1inch² FR-4 board, 2 oz Cu Thermal resistance junction-pcb max 30 °C/W Tl Maximum lead temperature for soldering purpose 300 °C Table 4. Avalanche characteristics Symbol Parameter Value Unit IAS Avalanche current, repetitive or not- repetitive (pulse width limited by Tj max) 2.5 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 400 mJ |
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