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STM32L151VB-A 数据表(PDF) 96 Page - STMicroelectronics

部件名 STM32L151VB-A
功能描述  Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3,128KB Flash, 32KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC
PDF  129 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32L151VB-A 数据表(HTML) 96 Page - STMicroelectronics

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Electrical characteristics
STM32L151x6/8/B-A STM32L152x6/8/B-A
96/129
DocID024330 Rev 4
tS
Sampling time(5)
Direct channels
2.4 V
≤VDDA ≤3.6 V
0.25
-
-
µs
Multiplexed channels
2.4 V
≤VDDA ≤3.6 V
0.56
-
-
Direct channels
1.8 V
≤VDDA ≤2.4 V
0.56
-
-
Multiplexed channels
1.8 V
≤VDDA ≤2.4 V
1-
-
-
4
-
384
1/fADC
tCONV
Total conversion time
(including sampling time)
fADC = 16 MHz
1
-
24.75
µs
-
4 to 384 (sampling
phase) +12 (successive
approximation)
1/fADC
CADC
Internal sample and hold
capacitor
Direct channels
-
16
-
pF
Multiplexed channels
-
-
fTRIG
External trigger frequency
Regular sequencer
12-bit conversions
-
-
Tconv+1 1/fADC
6/8/10-bit conversions
-
-
Tconv
1/fADC
fTRIG
External trigger frequency
Injected sequencer
12-bit conversions
-
-
Tconv+2 1/fADC
6/8/10-bit conversions
-
-
Tconv+1 1/fADC
RAIN
Signal source impedance(5)
--
-
50
κΩ
tlat
Injection trigger conversion
latency
fADC = 16 MHz
219
-
281
ns
-3.5
-
4.5
1/fADC
tlatr
Regular trigger conversion
latency
fADC = 16 MHz
156
-
219
ns
-2.5
-
3.5
1/fADC
tSTAB
Power-up time
-
-
-
3.5
µs
1. The VREF+ input can be grounded if neither the ADC nor the DAC are used (this allows to shut down an
external voltage reference).
2. The current consumption through VREF is composed of two parameters:
- one constant (max 300 µA)
- one variable (max 400 µA), only during sampling time + 2 first conversion pulses.
So, peak consumption is 300+400 = 700 µA and average consumption is 300 + [(4 sampling + 2) /16] x 400
= 450 µA at 1Msps
3. VREF+ can be internally connected to VDDA and VREF- can be internally connected to VSSA, depending on
the package. Refer to Section 4: Pin descriptions for further details.
4. VSSA or VREF- must be tied to ground.
5. See Table 57: Maximum source impedance RAIN max for RAIN limitations
Table 55. ADC characteristics (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit



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