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WP154A4AVS/RGB-CA 数据表(PDF) 2 Page - Kingbright Corporation |
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WP154A4AVS/RGB-CA 数据表(HTML) 2 Page - Kingbright Corporation |
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2 / 5 page ![]() © 2022 Kingbright. All Rights Reserved. Spec No: DSAQ1456 / 1102016226 Rev No: V.1A Date: 09/20/2022 Page 2 / 5 WP154A4AVS/RGB-CA ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C ABSOLUTE MAXIMUM RATINGS at TA=25°C Parameter Symbol Emitting Color Value Unit Typ. Max. Wavelength at Peak Emission IF = 20mA λpeak Hyper Red Blue Green 640 465 515 - nm Dominant Wavelength IF = 20mA λdom [1] Hyper Red Blue Green 625 470 525 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 20mA Δλ Hyper Red Blue Green 25 22 30 - nm Capacitance C Hyper Red Blue Green 27 100 45 - pF Forward Voltage IF = 20mA VF [2] Hyper Red Blue Green 2.2 3.3 3.3 2.8 4.0 4.1 V Reverse Current (VR = 5V) IR Hyper Red Blue Green - 10 50 50 µA Temperature Coefficient of λpeak IF = 20mA, -10°C ≤ T ≤ 85°C TCλpeak Hyper Red Blue Green 0.13 0.04 0.05 - nm/°C Temperature Coefficient of λdom IF = 20mA, -10°C ≤ T ≤ 85°C TCλdom Hyper Red Blue Green 0.06 0.03 0.03 - nm/°C Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C TCV Hyper Red Blue Green -2 -3 -3 - mV/°C Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Parameter Symbol Value Unit Hyper Red Green Power Dissipation PD 84 102.5 mW Junction Temperature Tj 115 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF 30 25 mA Peak Forward Current IFM [1] 150 150 mA Electrostatic Discharge Threshold (HBM) - 3000 450 V Lead Solder Temperature [3] 260°C For 3 Seconds Lead Solder Temperature [4] 260°C For 5 Seconds Blue 120 115 30 100 250 Reverse Voltage VR 5 5 5 V Thermal Resistance (Junction / Ambient) Rth JA [2] 170 230 310 °C/W Thermal Resistance (Junction / Solder point) Rth JS [2] 120 170 270 °C/W Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Rth JA ,Rth JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 3. 2mm below package base. 4. 5mm below package base. 5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. |
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