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T1235 数据表(PDF) 7 Page - STMicroelectronics |
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T1235 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 16 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 D²PAK package information • ECOPACK2® compliant • Lead-free package leads finishing • Molding compound resin is halogen-free and meets UL standard level V0 Figure 13. D²PAK package outline e G E1 E2 c2 A b b2 E V2 c A1 A2 A3 R Gauge Plane 1 2 3 Max resin gate protrusion: 0.5 mm (1) (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. BTA12, BTB12, T1205, T1210, T1235, T1250 Package information DS2115 - Rev 12 page 7/16 |
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