© 2020 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: GD. 11/24/20

CG5 and SL0902A Series

Gas Discharge Tubes

Note: These devices are not recommended for IR or Convection Reflow process.

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

s(min))

150°C

-Temperature Max (T

s(max))

200°C

-Time (Min to Max) (t

s)

60 – 180 secs

Average ramp up rate (LiquidusTemp (T

L)

to peak

3°C/second max

T

S(max) to TL - Ramp-up Rate

5°C/second max

Reflow

-Temperature (T

L) (Liquidus)

217°C

-Temperature (t

L)

60 – 150 seconds

PeakTemperature (T

P)

260+0/-5 °C

Time within 5°C of actual peakTemperature (t

p)

10 – 30 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

P)

8 minutes Max.

Do not exceed

260°C

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Time

TP

TL

TS(max)

TS(min)

25

tP

tL

tS

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

TL to TP

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

Soldering Parameters - Hand Soldering

Dwell Time

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

(Typical Industry Recommendation)

Temperature Minimum:

100° C

Temperature Maximum:

150° C

Preheat Time:

60-180 seconds

Solder Pot Temperature:

280° C Maximum

Solder Dwell Time:

2-5 seconds

Recommended Process Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Heating Time: 5 seconds max.