Anachip Corp.

www.anachip.com.tw

Rev. 1.0 Dec 16, 2004

10/10

Part Number

Package

P = Plastic 300 mil DIP

S = SOIC

Temperature Range andowe Options

Speed

Lead Free

Blank : Normal

L : Lead Free Package

J = Plastic (J) Leaded Chip Carrier (PLCC)

Suffix

Device

T = TSSOP

-7 = 7.5ns tpd

-10 = 10ns tpd

-15 = 15ns tpd

-25 = 25ns tpd

Anachip Corp.

Head Office

,

Anachip USA

2F, No. 24-2, Industry E. Rd. IV, Science-Based

780 Montague Expressway, #201

Industrial Park, Hsinchu, 300, Taiwan

San Jose, CA 95131

Tel: +886-3-5678234

Tel: (408) 321-9600

Fax: +886-3-5678368

Fax: (408) 321-9696

©2004 Anachip Corp.

Anachip reserves the right to make changes in specifications at any time and without notice. The information furnished by

Anachip in this publication is believed to be accurate and reliable. However, there is no responsibility assumed by Anachip for

its use nor for any infringements of patents or other rights of third parties resulting from its use. No license is granted under

any patents or patent rights of Anachip. Anachip’s products are not authorized for use as critical components in life support

devices or systems.

Marks bearing