Copyright

 ANPEC Electronics Corp.

Rev. A.2 - Oct., 2003

APR3021/2/3

www.anpec.com.tw

2

P a ckage C ode

A : S O T -2 3

B : S O T -2 3 -5

D : S O T -8 9

T e m p . R a nge

I : -4 0 to 8 5 C

H andling C ode

T R : T ape & R eel

V o ltage C o de :

15 : 1.5V ~ 43 : 4 .38 V

Lea d F re e C ode

L : Lead F ree D e vice

B lank : O rig in al D e vice

A P R 3021/2 /3 -

H andling C ode

T e m p . R a nge

P a ckage C ode

V o ltage C o de

D a te C o d e

X X

V o ltage C o de A :1.5V B :1.75V C :2.32V D :2.63V E :2.93V F :3.0 8 V G :3.9V H :4.3 8 V

2 1 /2 /3

A P R 3 021/2/3

XX XX X

1 5

XX XX X

- D a te C ode

;

15 - 1.5V

A P R 3 021/2/3 -1 5 D :

A P R 3 021/2/3 A /B :

Lea d F re e C ode

Ordering and Marking Information

Absolute Maximum Ratings

Symbol

Parameter

Value

Unit

-0.3 to 6

V

RESET to GND (Push-Pull Output)

RESET to GND (Open Drain Output)

-0.3 to 6

V

Maximum Continuous Input Current

20

mA

RESET/RESET Current

20

mA

dVcc/dt

100

V/

µs

Junction Temperature Range

-40 to 150

°C

Lead Temperature (Soldering, 10 second)

260

°C

SOT-23

357

SOT-23-5

357

Thermal Resistance – Junction to Ambient

SOT-89

180

°C/W

Power Dissipation

Internally Limited

W

°

Pin Descrpition

PIN

No.

Name

Description

RESET

(APR3021/3)

1

RESET

(APR3022)

2

Supply Voltage (+1.2V to +6V)

3

GND

Ground connection

Note: The pin sequence here might not be correct for all different package types, and please refer pin

configuration in page1 for correct pin assignment.