AS1321 datasheet(2/12 Pages) AMSCO

2 / 12 page

www.austriamicrosystems.com

Revision 1.01

2 - 12

AS132 1

austriamicrosystems

Data Sheet

4 Absolute Maximum Ratings

Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical

Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 1. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

All Pins to GND

-0.3

LX Current

Latch-Up

-100

100

JEDEC 78

Package Power Dissipation

(TAMB = +70ºC)

500

(

ΘJA = 9.1mW/ºC above +70ºC)

Operating Temperature Range

-40

+85

ºC

Electrostatic Discharge

-500

+500

HBM MIL-Std. 883E 3015.7 methods

Humidity (Non-Condensing)

Storage Temperature Range

-55

125

ºC

Junction Temperature

150

ºC

Package Body Temperature

260

ºC

The reflow peak soldering temperature (body

temperature) specified is in compliance with

IPC/JEDEC J-STD-020C “Moisture/ Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

AS1321 数据表(PDF) 2 Page - ams AG

AS1321 数据表(HTML) 2 Page - ams AG

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12

数据表下载