LTM8080

2

Rev. 0

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PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Switching Regulator

Minimum Input Voltage

l

3.5

V

Quiescent Current into VIN

RUN = 0V

8

μA

Maximum VBUS Output Current

VBUS = 2.5V, VOUT = 1.3V, IOUT = 1mA (Note 3)

1.5

A

Switching Frequency

RT = 221k

RT = 40.2k

RT = 16.2k

200

1

2.2

kHz

MHz

MHz

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, RUN ...................................................................42V

VBUS, VOUTn, VSNSn, SETn, PGn, PGFBn .....................9V

SYNC ..........................................................................6V

SS ...............................................................................4V

Maximum Internal Temperature (Note 2) .............. 125°C

Storage Temperature............................. –55°C to 125°C

Peak Reflow Solder Body Temperature ................ 250°C

(Note 1)

VIN

GND

TOP VIEW

GND

SYNC

PG1

PGFB1

PGFB2

PG2

VSNS1

SET1

SET2

VSNS2

RUN

SS

RT

6

5

4

3

2

1

A

B

C

D

E

F

G

H

BGA PACKAGE

48-PIN (9mm × 6.25mm × 3.32mm)

TJMAX = 125°C, θJA = 22.6°C/W, θJCtop = 40°C/W,

θJCbot = 9.7°C/W, WEIGHT = 0.45g

BANK 2

BANK 4

GND

BANK 5

VOUT1

BANK 3

VOUT2

BANK 1

VBUS

NOTES:

1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS.

2) θJA VALUE IS OBTAINED WITH DEMO BOARD.

3) SEE THE TYPICAL PERFORMANCE CHARACTERISTICS SECTION FOR

LAB-MEASURED DERATING CURVES.

ORDER INFORMATION

ELECTRICAL CHARACTERISTICS The

l

denotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA = 25°C. VIN = 12V unless otherwise noted (Note 2).

PART NUMBER

TERMINAL FINISH

PART MARKING

PACKAGE TYPE

MSL RATING

TEMPERATURE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM8080EY#PBF

SAC305 (RoHS)

LTM8080Y

e1

BGA

4

–40°C to 125°C

LTM8080IY#PBF

SAC305 (RoHS)

LTM8080Y

e1

BGA

4

–40°C to 125°C

LTM8080MPY#PBF

SAC305 (RoHS)

LTM8080Y

e1

BGA

4

–55°C to 125°C

• Device temperature grade is indicated by a label on the shipping container.

• Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended BGA PCB Assembly and Manufacturing Procedures.

• BGA Package and Tray Drawings